This document provides guidelines for printed circuit board (PCB) designs for Power Quad Flat No-Lead (PQFN/QFN) packages soldered on thermal via.
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PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation - AN3778
This document provides guidelines for printed circuit board (PCB) designs for Power Quad Flat No-Lead (PQFN/QFN) packages soldered on thermal via.
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